Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US17405431Application Date: 2021-08-18
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Publication No.: US11823918B2Publication Date: 2023-11-21
- Inventor: Akiko Kai
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Venjuris, P.C.
- Priority: JP 20144694 2020.08.28
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; H10K71/15
Abstract:
A substrate processing method includes supplying a processing liquid to a peripheral edge of a surface of a substrate to form a processing film on the peripheral edge of the surface of the substrate; and bringing a molding solvent supplied to an inner region than a region of the surface of the substrate to which the processing liquid is supplied, into contact with an interface of the processing liquid that faces a central side of the surface.
Public/Granted literature
- US20220068670A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2022-03-03
Information query
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