Invention Grant
- Patent Title: Solder composition for use in solder joints of printed circuit boards
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Application No.: US17644593Application Date: 2021-12-16
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Publication No.: US11832386B2Publication Date: 2023-11-28
- Inventor: Deeder M. Aurongzeb
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: McDermott Will & Emery LLP
- Main IPC: B23K35/00
- IPC: B23K35/00 ; H05K1/09 ; H05K3/40 ; B23K35/26 ; C22C13/02 ; B23K35/22 ; B23K1/00 ; H05K1/11
Abstract:
A solder composition for use in solder joints of printed circuit boards (PCBs), including a compound layer comprising an alloy of bismuth and tin; and a graphene coating positioned on the compound layer.
Public/Granted literature
- US20230199949A1 SOLDER COMPOSITION FOR USE IN SOLDER JOINTS OF PRINTED CIRCUIT BOARDS Public/Granted day:2023-06-22
Information query
