Invention Grant
- Patent Title: Sensor
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Application No.: US17432940Application Date: 2020-02-26
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Publication No.: US11832499B2Publication Date: 2023-11-28
- Inventor: Hidekazu Ohara , Tsuyoshi Miyata
- Applicant: OMRON Corporation
- Applicant Address: JP Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto
- Agency: JCIPRNET
- Priority: JP 19038686 2019.03.04
- International Application: PCT/JP2020/007689 2020.02.26
- International Announcement: WO2020/179573A 2020.09.10
- Date entered country: 2021-08-23
- Main IPC: H10K59/60
- IPC: H10K59/60 ; H10K50/87

Abstract:
A sensor includes a metal housing and a metal lid. The metal housing houses a circuit board electrically connected to a sensor element and is provided with an opening and an edge part defining the opening. The metal lid is adhered to the edge part to cover the opening. At least one of the edge part and the metal lid is provided with one or more recesses, and the metal lid is adhered to the edge part by a portion of an adhesive agent filled in the recess that is located in a region of an opening end of the recess.
Public/Granted literature
- US20220173175A1 SENSOR Public/Granted day:2022-06-02
Information query