Invention Grant
- Patent Title: Three-dimensional printing
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Application No.: US17294445Application Date: 2019-06-10
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Publication No.: US11833751B2Publication Date: 2023-12-05
- Inventor: Jesiska Tandy , Stanley J. Kozmiski , Alay Yemane
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2019/036271 2019.06.10
- International Announcement: WO2020/251524A 2020.12.17
- Date entered country: 2021-05-17
- Main IPC: B29C64/165
- IPC: B29C64/165 ; B33Y10/00 ; B33Y70/00 ; B33Y30/00 ; B29C64/264 ; B29K105/00 ; B29K309/08

Abstract:
A materials kit for 3D printing can include a powder bed material including from about 60 wt % to 100 wt % composite fibers having an average aspect ratio from about 3:1 to about 30:1 and a fusing agent including an energy absorber to absorb electromagnetic radiation to produce heat. The composite fibers can include glass fibers coated with an encapsulating polymer, wherein the glass fibers can be included at from about 5 wt % to about 40 wt % based on the total weight of the powder bed material.
Public/Granted literature
- US20220105679A1 THREE-DIMENSIONAL PRINTING Public/Granted day:2022-04-07
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