Invention Grant
- Patent Title: Methods, apparatuses, and systems for edge sealing laminate wafers containing a soft deformable inner film
-
Application No.: US17120638Application Date: 2020-12-14
-
Publication No.: US11833772B2Publication Date: 2023-12-05
- Inventor: Zbigniew Tokarski , Eric Begg , Ahmed Drammeh , Hao-Wen Chiu
- Applicant: Essilor International
- Applicant Address: FR Charenton-le-Pont
- Assignee: Essilor International
- Current Assignee: Essilor International
- Current Assignee Address: FR Charenton-le-pont
- Agency: NIXON & VANDERHYE
- Priority: EP 306667 2019.12.17
- Main IPC: B29D11/00
- IPC: B29D11/00 ; B29B11/02 ; B29K101/12 ; G02C7/02

Abstract:
The present disclosure includes systems, apparatuses, and methods for an optical system. In some aspects, the systems and devices may produce a wafer for use in the manufacture of an optical article. The wafer includes a laminate having a first layer that includes a first matrix material having a lower surface and an upper surface opposite the lower surface and a second layer that includes a second matrix material, the second layer is coupled to the first layer and covers at least a portion of the lower surface or the upper surface. The first layer includes a first thickness at a central portion that is greater than a second thickness at an edge portion.
Public/Granted literature
Information query