Invention Grant
- Patent Title: Adhesive composition for semiconductor circuit connection and adhesive film including the same
-
Application No.: US16769786Application Date: 2019-04-17
-
Publication No.: US11834415B2Publication Date: 2023-12-05
- Inventor: Ju Hyeon Kim , Junghak Kim , Seunghee Nam , Kwang Joo Lee
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: ROTHWELL, FIGG, ERNST & MANBECK, P.C.
- Priority: KR 20180044654 2018.04.17 KR 20190043931 2019.04.15
- International Application: PCT/KR2019/004651 2019.04.17
- International Announcement: WO2019/203572A 2019.10.24
- Date entered country: 2020-06-04
- Main IPC: C07D233/58
- IPC: C07D233/58 ; C08J5/18 ; C09J133/08 ; C09J163/00 ; C09J171/12 ; H01L23/00
Abstract:
The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.
Public/Granted literature
- US20200308121A1 ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION AND ADHESIVE FILM INCLUDING THE SAME Public/Granted day:2020-10-01
Information query
