Invention Grant
- Patent Title: Integrated circuit composite test generation
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Application No.: US17349568Application Date: 2021-06-16
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Publication No.: US11836431B2Publication Date: 2023-12-05
- Inventor: John Lee , Aveek Sarkar , Altan Odabasi , Scott Johnson , Murat Becer , William Mullen
- Applicant: ANSYS, Inc.
- Applicant Address: US PA Canonsburg
- Assignee: ANSYS, INC.
- Current Assignee: ANSYS, INC.
- Current Assignee Address: US PA Canonsburg
- Main IPC: G06F30/367
- IPC: G06F30/367

Abstract:
A chip package system comprising N multiple processor cores can be tested by receiving a data file characterizing the chip package system. Thereafter, simulation testing is conducted for each core for each of Mi . . . j states using the data file such that each core is active in each state while all other cores are inactive. Each simulation test results in a simulation. The simulations are then combined to result in a composite test covering MN*j combinations. Related apparatus, systems, techniques and articles are also described.
Public/Granted literature
- US20210350059A1 Integrated Circuit Composite Test Generation Public/Granted day:2021-11-11
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