A packaged semiconductor device includes a semiconductor die having a top side including a semiconductor surface layer having circuitry configured for a function coupled to bond pads, and a bottom side. A leadframe includes a die pad and leads or lead terminals on at least two sides of the die pad. At least one non-through hole for delamination prevention is in at least one of the die pad and the lead or the lead terminals. The semiconductor die is mounted by a die attach material with the bottom side down on the die pad. A mold compound provides encapsulation for the package semiconductor device except for at least a bottom side of the lead terminals or sidewalls of the package for the leads. The non-through hole is a filled hole filled with either the die attach material or the mold compound.