- Patent Title: Bonding passive devices on active device dies to form 3D packages
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Application No.: US16806026Application Date: 2020-03-02
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Publication No.: US11837575B2Publication Date: 2023-12-05
- Inventor: Chen-Hua Yu , Kuo Lung Pan , Shu-Rong Chun , Chi-Hui Lai , Tin-Hao Kuo , Hao-Yi Tsai , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/64
- IPC: H01L23/64 ; H01L23/00 ; H01L23/31 ; H01L23/498 ; H01L25/00 ; H01L21/56 ; H01L25/065 ; H01L23/367
Abstract:
A package includes a package substrate, an interposer over and bonded to the package substrate, a first wafer over and bonding to the interposer, and a second wafer over and bonding to the first wafer. The first wafer has independent passive device dies therein. The second wafer has active device dies therein.
Public/Granted literature
- US20210066242A1 Bonding Passive Devices on Active Device Dies to Form 3D Packages Public/Granted day:2021-03-04
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