Invention Grant
- Patent Title: Gate trench power semiconductor devices having improved deep shield connection patterns
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Application No.: US18109933Application Date: 2023-02-15
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Publication No.: US11837657B2Publication Date: 2023-12-05
- Inventor: Naeem Islam , Woongsun Kim , Daniel J. Lichtenwalner , Sei-Hyung Ryu
- Applicant: Wolfspeed, Inc.
- Applicant Address: US NC Durham
- Assignee: Wolfspeed, Inc.
- Current Assignee: Wolfspeed, Inc.
- Current Assignee Address: US NC Durham
- Agency: Myers Bigel, P.A.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/16

Abstract:
A power semiconductor device comprises a semiconductor layer structure having a wide band-gap drift region having a first conductivity type, a gate trench having first and second opposed sidewalls that extend in a first direction in an upper portion of the semiconductor layer structure, first and second well regions having a second conductivity type in the upper portion of the semiconductor layer structure, the first well region comprising part of the first sidewall and the second well region comprising part of the second sidewall. A deep shielding region having the second conductivity type is provided underneath the gate trench, and a plurality of deep shielding connection patterns that have the second conductivity type are provided that electrically connect the deep shielding region to the first and second well regions. The deep shielding connection patterns are spaced apart from each other along the first direction.
Public/Granted literature
- US20230207686A1 GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING IMPROVED DEEP SHIELD CONNECTION PATTERNS Public/Granted day:2023-06-29
Information query
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