Invention Grant
- Patent Title: Circuit methodology for highly linear and symmetric resistive processing unit
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Application No.: US17137615Application Date: 2020-12-30
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Publication No.: US11842770B2Publication Date: 2023-12-12
- Inventor: Tayfun Gokmen , Seyoung Kim , Hyung-Min Lee , Wooram Lee , Paul Michael Solomon
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: McGinn I.P. Law Group, PLLC
- Agent James Olsen
- Main IPC: G11C16/04
- IPC: G11C16/04 ; G11C13/00 ; G11C7/10 ; G11C11/54 ; G06N3/049 ; G06N3/084 ; G06N3/088 ; G06N3/065 ; G06N3/02
Abstract:
A processing unit, including a first circuit, and a first circuit element connected to the first circuit. The first circuit element is at least charged by the first circuit.
Public/Granted literature
- US20210151102A1 CIRCUIT METHODOLOGY FOR HIGHLY LINEAR AND SYMMETRIC RESISTIVE PROCESSING UNIT Public/Granted day:2021-05-20
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