Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US17707384Application Date: 2022-03-29
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Publication No.: US11842856B2Publication Date: 2023-12-12
- Inventor: Hye Won Kim , Won Kuen Oh , Chae Dong Lee , Og Soon Kim , Jung Won Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20210194081 2021.12.31
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/012 ; H01G4/008

Abstract:
A multilayer electronic component includes a body including a dielectric layer and internal electrodes and external electrodes disposed on the body and connected to the internal electrodes, wherein the external electrodes include a first electrode layer disposed on the body and including Cu and glass, a second electrode layer disposed on the first electrode layer and including Ni and Cu, and a third electrode layer disposed on the second electrode layer and including Ni and glass.
Public/Granted literature
- US20230215649A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2023-07-06
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