- Patent Title: Wafer chuck, method for producing the same, and exposure apparatus
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Application No.: US17037386Application Date: 2020-09-29
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Publication No.: US11842918B2Publication Date: 2023-12-12
- Inventor: Keiji Hirabayashi
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc., IP Division
- Priority: JP 19182530 2019.10.02 JP 20134003 2020.08.06
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/683 ; G03F7/00 ; C23C16/02 ; C23C16/27 ; C23C16/458
Abstract:
A wafer chuck includes a base made of a ceramic containing silicon carbide. The base has an oxidation-treated layer, and a film made of diamond-like carbon (DLC) is formed on an outermost surface of the base.
Public/Granted literature
- US20210104428A1 WAFER CHUCK, METHOD FOR PRODUCING THE SAME, AND EXPOSURE APPARATUS Public/Granted day:2021-04-08
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