Invention Grant
- Patent Title: Conductive structure including copper-phosphorous alloy and a method of manufacturing conductive structure
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Application No.: US17697937Application Date: 2022-03-18
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Publication No.: US11842958B2Publication Date: 2023-12-12
- Inventor: Chun-Ming Lin
- Applicant: Chun-Ming Lin
- Applicant Address: TW Hsinchu County
- Assignee: Chun-Ming Lin
- Current Assignee: Chun-Ming Lin
- Current Assignee Address: TW Hsinchu County
- Agency: WPAT, P.C., INTELLECTUAL PROPERTY ATTORNEYS
- Agent Anthony King
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/11 ; H01L23/498 ; C25D7/12 ; H01L21/48 ; C25D3/38 ; H05K1/18
Abstract:
The present disclosure provides a multilayer wiring structure, including a plurality of dielectric layers, a plurality of conductive wiring layers interleaved with the plurality of dielectric layers, wherein the plurality of conductive wiring layers includes copper-phosphorous alloys (such as Cu3P).
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