Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the semiconductor device
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Application No.: US17496300Application Date: 2021-10-07
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Publication No.: US11843037B2Publication Date: 2023-12-12
- Inventor: Dukhyun Choe , Jinseong Heo , Yunseong Lee , Sanghyun Jo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20210036079 2021.03.19 KR 20210040542 2021.03.29
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/78 ; H01L29/49 ; H01L29/51 ; H01L29/66 ; H10K10/46

Abstract:
Provided are a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes a substrate, a channel layer at least one of on or in the substrate, an insulation layer on the substrate, a ferroelectric layer on the insulation layer, a fixed charge layer on an interface between the insulation layer and the ferroelectric layer, the fixed charge layer including charges of a first polarity, and a gate on the ferroelectric layer.
Public/Granted literature
- US20220302267A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE Public/Granted day:2022-09-22
Information query
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