Invention Grant
- Patent Title: Method of manufacturing MOSFET having a semiconductor base substrate with a super junction structure
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Application No.: US17726536Application Date: 2022-04-22
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Publication No.: US11843048B2Publication Date: 2023-12-12
- Inventor: Daisuke Arai , Mizue Kitada , Takeshi Asada , Noriaki Suzuki , Koichi Murakami
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: HAUPTMAN HAM, LLP
- The original application number of the division: US16603700
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/32 ; H01L29/66

Abstract:
A MOSFET includes: a semiconductor base substrate having an n-type column region and a p-type column region, the n-type column region and the p-type column region forming a super junction structure; and a gate electrode formed by way of a gate insulation film. Assuming a region of the semiconductor base substrate which provides a main operation of the MOSFET as an active region, a region of the semiconductor base substrate maintaining a withstand voltage of the MOSFET as an outer peripheral region, and a region of the semiconductor base substrate disposed between the active region and the outer peripheral region as an active connecting region, out of the active region, the active connecting region, and the outer peripheral region of the semiconductor base substrate, the crystal defects are formed only in the active region and the active connecting region.
Public/Granted literature
- US20220246755A1 METHOD OF MANUFACTURING MOSFET Public/Granted day:2022-08-04
Information query
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