Invention Grant
- Patent Title: Crimp structure
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Application No.: US17080222Application Date: 2020-10-26
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Publication No.: US11843216B2Publication Date: 2023-12-12
- Inventor: Kazuhiro Mizukami
- Applicant: Tyco Electronics Japan G.K.
- Applicant Address: JP Kawasaki
- Assignee: Tyco Electronics Japan G. K.
- Current Assignee: Tyco Electronics Japan G. K.
- Current Assignee Address: JP Kawasaki
- Agency: Barley Snyder
- Priority: JP 19194503 2019.10.25
- Main IPC: H01R9/05
- IPC: H01R9/05 ; H01B7/02 ; H01R24/40
Abstract:
A crimp structure includes a crimp section having an insulated ferrule disposed inside an outer conductor of a shielded cable. The outer conductor and a ground contact placed on an outer periphery of the outer conductor are crimped.
Public/Granted literature
- US20210126384A1 Crimp Structure Public/Granted day:2021-04-29
Information query
