Invention Grant
- Patent Title: Light emitting device and method of manufacturing light emitting device
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Application No.: US17718857Application Date: 2022-04-12
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Publication No.: US11843220B2Publication Date: 2023-12-12
- Inventor: Masatoshi Nakagaki , Kazuma Kozuru
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Foley & Lardner LLP
- Priority: JP 19005520 2019.01.16
- Main IPC: H01S5/02255
- IPC: H01S5/02255 ; H01S5/02325 ; H01S5/0236

Abstract:
A light emitting device includes: a first semiconductor laser element; a base portion including: a bottom portion including a first upper surface on which the first semiconductor laser element is disposed, and a frame portion surrounding the first semiconductor laser element, the frame portion including a second upper surface positioned above the first upper surface and a support portion positioned between the first upper surface and the second upper surface, the a support portion having a support area; a light reflecting member having a flat plate-shaped and contacting the support area, the light reflecting member being configured to reflect light from the first semiconductor laser element; and a lid portion bonded to the second upper surface.
Public/Granted literature
- US20220239060A1 LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2022-07-28
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