Invention Grant
- Patent Title: Signal processing device, signal processing method, and reception device
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Application No.: US17310148Application Date: 2020-01-14
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Publication No.: US11843488B2Publication Date: 2023-12-12
- Inventor: Yutaka Nakada
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: CHIP LAW GROUP
- Priority: JP 19014435 2019.01.30
- International Application: PCT/JP2020/000795 2020.01.14
- International Announcement: WO2020/158359A 2020.08.06
- Date entered country: 2021-07-21
- Main IPC: H04L27/14
- IPC: H04L27/14 ; H04B1/16

Abstract:
A signal processing device includes an acquisition unit that acquires identification information associated with data obtained by decoding a reception signal that includes a signal included in a first layer and a signal included in a different layer and superimposed on the signal of the first layer in a power axis direction, the data being output to a post-stage processing unit, a decoding unit that decodes the signal of the different layer on the basis of a result of decoding of the signal of the first layer after the decoding of the signal of the first layer, and an output control unit that outputs data obtained by decoding the signal of the different layer to the post-stage processing unit without outputting data obtained by decoding the signal of the first layer to the post-stage processing unit, in a case where data identified by the identification information is data obtained by decoding the signal of the different layer.
Public/Granted literature
- US20220070034A1 SIGNAL PROCESSING DEVICE, SIGNAL PROCESSING METHOD, RECEPTION DEVICE, AND SIGNAL PROCESSING PROGRAM Public/Granted day:2022-03-03
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