Invention Grant
- Patent Title: Sensor bracket structure
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Application No.: US17527164Application Date: 2021-11-16
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Publication No.: US11852286B2Publication Date: 2023-12-26
- Inventor: Masayuki Oguri , Yoshinori Gemba , Daisuke Tsuburaoka , Shinya Matsumoto , Yu Hidaka
- Applicant: Honda Motor Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: CN 2022656425.1 2020.11.17
- Main IPC: F16M13/02
- IPC: F16M13/02 ; B60R11/04 ; B60R11/00

Abstract:
The disclosure provides a sensor bracket structure adapted to mount an external sensor to a moving body via a bracket. The bracket includes a fixing surface and a load receiving surface connected to the fixing surface. The external sensor is fixed to the fixing surface. The load receiving surface extends from the fixing surface toward the top in a direction where the load receiving surface intersects with the fixing surface. The load receiving surface extends from an outermost side of the external sensor toward the outside.
Public/Granted literature
- US20220154876A1 SENSOR BRACKET STRUCTURE Public/Granted day:2022-05-19
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