Invention Grant
- Patent Title: Multilayer wiring substrate, method of manufacturing same, and probe card having same
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Application No.: US17038642Application Date: 2020-09-30
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Publication No.: US11852655B2Publication Date: 2023-12-26
- Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
- Applicant: POINT ENGINEERING CO., LTD.
- Applicant Address: KR Asan
- Assignee: POINT ENGINEERING CO., LTD.
- Current Assignee: POINT ENGINEERING CO., LTD.
- Current Assignee Address: KR Asan
- Priority: KR 20190129263 2019.10.17
- Main IPC: G01R1/073
- IPC: G01R1/073 ; H05K1/02 ; H05K3/10 ; H05K3/46
Abstract:
Proposed is a multilayer wiring substrate having excellent joining strength, a method of manufacturing the multilayer wiring substrate, and a probe card having the multilayer wiring substrate.
Public/Granted literature
- US20210116478A1 MULTILAYER WIRING SUBSTRATE, METHOD OF MANUFACTURING SAME, AND PROBE CARD HAVING SAME Public/Granted day:2021-04-22
Information query
