Invention Grant
- Patent Title: Measuring method and plasma processing apparatus
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Application No.: US17220094Application Date: 2021-04-01
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Publication No.: US11854767B2Publication Date: 2023-12-26
- Inventor: Masanori Sato
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JP 20067730 2020.04.03
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/683

Abstract:
A measuring method includes placing a substrate on an electrostatic chuck disposed inside a chamber, attracting the substrate onto the electrostatic chuck, generating plasma inside the chamber, detecting an amount of light reflected at the substrate by light emission of the plasma, and calculating a natural frequency of the substrate based on the amount of light.
Public/Granted literature
- US20210313146A1 MEASURING METHOD AND PLASMA PROCESSING APPARATUS Public/Granted day:2021-10-07
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