Invention Grant
- Patent Title: Plasma processing apparatus and plasma processing method
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Application No.: US17311149Application Date: 2019-11-26
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Publication No.: US11854772B2Publication Date: 2023-12-26
- Inventor: Masaki Hirayama
- Applicant: TOKYO ELECTRON LIMITED , TOHOKU UNIVERSITY
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED,TOHOKU UNIVERSITY
- Current Assignee: TOKYO ELECTRON LIMITED,TOHOKU UNIVERSITY
- Current Assignee Address: JP Tokyo; JP Miyagi
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JP 18229243 2018.12.06
- International Application: PCT/JP2019/046236 2019.11.26
- International Announcement: WO2020/116257A 2020.06.11
- Date entered country: 2021-06-04
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
A plasma processing apparatus according to an exemplary embodiment includes a processing container, a stage, a dielectric plate, an upper electrode, an introduction part, a driving shaft, and an actuator. The stage is provided in the processing container. The dielectric plate is provided above the stage via a space in the processing container. The upper electrode has flexibility, is provided above the dielectric plate, and provides a gap between the dielectric plate and the upper electrode. The introduction part is an introduction part of radio frequency waves that are VHF waves or UHF waves, is provided at a horizontal end portion of the space. The driving shaft is coupled to the upper electrode on a central axial line of the processing container. The actuator is configured to move the driving shaft in a vertical direction.
Public/Granted literature
- US20220028666A1 PROCESSING APPARATUS AND PLASMA PROCESSING METHOD Public/Granted day:2022-01-27
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