Invention Grant
- Patent Title: Permeance magnetic assembly
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Application No.: US17876422Application Date: 2022-07-28
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Publication No.: US11854776B2Publication Date: 2023-12-26
- Inventor: Tsung-Jen Yang , Yi-Zhen Chen , Chih-Pin Wang , Chao-Li Shih , Ching-Hou Su , Cheng-Yi Huang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- The original application number of the division: US16596109 2019.10.08
- Main IPC: H01J37/34
- IPC: H01J37/34 ; C23C14/35
Abstract:
In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.
Public/Granted literature
- US20220367160A1 PERMEANCE MAGNETIC ASSEMBLY Public/Granted day:2022-11-17
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