Invention Grant
- Patent Title: Method for manufacturing display array
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Application No.: US17974531Application Date: 2022-10-27
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Publication No.: US11855062B2Publication Date: 2023-12-26
- Inventor: Ming-Hsien Wu , Chia-Hsin Chao , Yen-Hsiang Fang
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW 7144426 2018.12.11
- The original application number of the division: US16232064 2018.12.26
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L27/12 ; H01L27/15

Abstract:
A method for manufacturing a display array includes the following steps: providing a substrate and forming a semiconductor stacked layer on the substrate; forming an insulating layer and a plurality of electrode pads on an outer surface of the semiconductor stacked layer, the insulating layer and the electrode pads directly contacting the semiconductor stacked layer, wherein the insulating layer has a plurality of openings spaced apart from each other; and transferring the semiconductor stacked layer, the insulating layer and the electrode pads from the substrate to a driving backplane, wherein the electrode pads are respectively electrically connected to the driving backplane through the openings of the insulating layer to form a plurality of light emitting regions in the semiconductor stacked layer as the electrode pads and the semiconductor stacked layer are energized by the driving backplane.
Public/Granted literature
- US20230053079A1 METHOD FOR MANUFACTURING DISPLAY ARRAY Public/Granted day:2023-02-16
Information query
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