Invention Grant
- Patent Title: High-frequency signal processing apparatus and wireless communication apparatus
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Application No.: US18142469Application Date: 2023-05-02
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Publication No.: US11856525B2Publication Date: 2023-12-26
- Inventor: Satoshi Tanaka , Kiichiro Takenaka , Takayuki Tsutsui , Taizo Yamawaki , Shun Imai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP 11287648 2011.12.28
- Main IPC: H04W52/24
- IPC: H04W52/24 ; H03F3/19 ; H03F1/02 ; H03F3/21 ; H03F3/189 ; H04W52/02 ; H03F3/24 ; H04B1/04 ; H04W88/06

Abstract:
A high-frequency signal processing apparatus and a wireless communication apparatus can achieve a decrease in power consumption. For example, when an indicated power level to a high-frequency power amplifier is equal to or greater than a second reference value, envelope tracking is performed by causing a source voltage control circuit to control a high-speed DCDC converter using a detection result of an envelope detecting circuit and causing a bias control circuit to indicate a fixed bias value. The source voltage control circuit and the bias control circuit indicate a source voltage and a bias value decreasing in proportion to a decrease in the indicated power level when the indicated power level is in a range of the second reference value to the first reference value, and indicate a fixed source voltage and a fixed bias value when the indicated power level is less than the first reference value.
Public/Granted literature
- US20230276372A1 HIGH-FREQUENCY SIGNAL PROCESSING APPARATUS AND WIRELESS COMMUNICATION APPARATUS Public/Granted day:2023-08-31
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