Invention Grant
- Patent Title: Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device
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Application No.: US17558341Application Date: 2021-12-21
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Publication No.: US11856687B2Publication Date: 2023-12-26
- Inventor: Sandro Bulovic
- Applicant: SEMIKRON ELEKTRONIK GMBH & CO. KG
- Applicant Address: DE Nuremberg
- Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KG
- Current Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KG
- Current Assignee Address: DE Nuremberg
- Agency: Nolte Lackenbach Siegel
- Agent Andrew F. Young
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/495
Abstract:
A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device. The cooling device has a first and a second main surface. The power semiconductor module is arranged on the first main surface and is in thermally conducting contact with the cooling device and the capacitor device is arranged on the second main surface and is in thermally conducting contact with the cooling device. At least one DC connection device is connected to a DC module connection of the power semiconductor module and has a first cooling section, which is in thermally conducting contact with the cooling device.
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