Invention Grant
- Patent Title: Horizontally mounted capacitor module and electronic device including same
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Application No.: US17225209Application Date: 2021-04-08
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Publication No.: US11856700B2Publication Date: 2023-12-26
- Inventor: Chunghyun Ryu , Byungok Kang , Su-Yong An , Jongwoo Jang , Insub Kwak , Teck Su Oh , Geurim Jung , Sang-Ho Park , Sung-Ki Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Fish & Richardson P.C.
- Priority: KR 20200052095 2020.04.29 KR 20200154402 2020.11.18
- Main IPC: H01G9/08
- IPC: H01G9/08 ; H05K1/18 ; H01G9/008 ; H01G9/045

Abstract:
A capacitor module horizontally mounted on a PCB and including a case including a first side surface, an opposing second side, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface, and an electrolytic capacitor including a dielectric extending in a first horizontal direction, a first electrode contacting the first electrode pad and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from second electrode pad in a second horizontal direction.
Public/Granted literature
- US20210345489A1 HORIZONTALLY MOUNTED CAPACITOR MODULE AND ELECTRONIC DEVICE INCLUDING SAME Public/Granted day:2021-11-04
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