Invention Grant
- Patent Title: Thermal conduction unit, electronic module and heat dissipating device
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Application No.: US16588666Application Date: 2019-09-30
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Publication No.: US11856856B2Publication Date: 2023-12-26
- Inventor: Wen-Long Lu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H10N10/13
- IPC: H10N10/13 ; H01L23/38 ; H10N10/17 ; G01N25/32 ; H10N10/01 ; H10N10/852 ; H10N19/00
Abstract:
A thermal conduction unit includes a conductive via, a periphery conductor and an isolation material. The conductive via includes a first thermoelectric material. The periphery conductor encloses the conductive via and includes a second thermoelectric material. An end of the periphery conductor is electrically connected to an end of the conductive via. The isolation material is interposed between the conductive via and the periphery conductor.
Public/Granted literature
- US20210098677A1 THERMAL CONDUCTION UNIT, ELECTRONIC MODULE AND HEAT DISSIPATING DEVICE Public/Granted day:2021-04-01
Information query
