Invention Grant
- Patent Title: Binding machine
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Application No.: US17172471Application Date: 2021-02-10
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Publication No.: US11858670B2Publication Date: 2024-01-02
- Inventor: Osamu Itagaki , Shinpei Sugihara , Kouichirou Morimura , Yusuke Yoshida , Ichiro Kusakari
- Applicant: MAX CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: MAX CO., LTD.
- Current Assignee: MAX CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: WEIHROUCH IP
- Priority: JP 20021025 2020.02.10 JP 20219758 2020.12.29
- Main IPC: B65B13/02
- IPC: B65B13/02 ; B65B13/28 ; E04G21/12 ; B25B25/00 ; B65B13/22

Abstract:
A binding machine includes: a wire feeding unit configured to feed a wire; a curl forming unit configured to form a path along which the wire fed by the wire feeding unit is to be wound around a to-be-bound object; a butting part against which the to-be-bound object is to be butted; a cutting unit configured to cut the wire wound on the to-be-bound object; a binding unit configured to twist the wire wound on the to-be-bound object and cut by the cutting unit; and a tension applying part configured to apply tension to the wire to be cut at the cutting unit with a force higher than a force applied in a loosening direction of the wire wound on the to-be-bound object.
Public/Granted literature
- US20210245904A1 BINDING MACHINE Public/Granted day:2021-08-12
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