Invention Grant
- Patent Title: Sintering jig
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Application No.: US16391767Application Date: 2019-04-23
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Publication No.: US11858860B2Publication Date: 2024-01-02
- Inventor: Giyoung Jo , Chan Kwak , Taewon Jeong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co. Ltd.
- Current Assignee: Samsung Electronics Co. Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: HARNESS, DICKEY & PIERCE, P.L.C.
- Priority: KR 20180153717 2018.12.03
- Main IPC: B30B15/02
- IPC: B30B15/02 ; C04B35/64 ; C04B35/48 ; C04B41/87 ; B29C35/02 ; B29C33/00

Abstract:
A sintering jig according to the disclosure includes a first plate including a plurality of protrusions and a second plate stacked on the first plate and including through holes corresponding to the protrusions. The through hole includes a cylindrical portion through which the protrusion enter and exit and a conical portion widening towards an upper surface of the second plate from the cylindrical portion.
Public/Granted literature
- US20200172445A1 SINTERING JIG Public/Granted day:2020-06-04
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