Invention Grant
- Patent Title: Fluid cooling apparatus
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Application No.: US16311391Application Date: 2017-01-31
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Publication No.: US11859873B2Publication Date: 2024-01-02
- Inventor: Donghun Lee , Mungyu Kim , Joonho Min , Hyunki Park , Chihun Lee
- Applicant: SAMSUNG HEAVY IND. CO., LTD
- Applicant Address: KR Gyeonggi-do
- Assignee: SAMSUNG HEAVY IND. CO., LTD
- Current Assignee: SAMSUNG HEAVY IND. CO., LTD
- Current Assignee Address: KR Gyeonggi-Do
- Agency: CARTER, DELUCA & FARRELL LLP
- Priority: KR 20160078200 2016.06.22
- International Application: PCT/KR2017/001019 2017.01.31
- International Announcement: WO2017/222138A 2017.12.28
- Date entered country: 2018-12-19
- Main IPC: F25B9/06
- IPC: F25B9/06 ; F25J1/00 ; F25J1/02 ; F25B31/00 ; F25B41/00 ; F25B1/10 ; F25B3/00

Abstract:
A fluid cooling apparatus capable of improving liquefaction efficiency of a fluid by appropriately cooling the fluid in various temperature ranges through a simple process. The fluid cooling apparatus includes an expansion unit including a plurality of expanders, which receive refrigerants through a plurality of paths to expand the refrigerants and discharge the expanded refrigerants having different temperatures, a heat exchanger receiving the refrigerants having different temperatures from the expansion unit to cool the fluid in multistages, a precompression unit including a plurality of precompressors, which receive the refrigerants passing through the heat exchanger to compress the refrigerants and discharge the compressed refrigerants at the same pressure, a mixing tube configured to mix the refrigerants discharged from the precompression unit to supply the mixed refrigerant, and a main compression unit connected to the mixing tube to compress the mixed refrigerant and supply the compressed refrigerant to the expansion unit.
Public/Granted literature
- US20190195536A1 FLUID COOLING APPARATUS Public/Granted day:2019-06-27
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