Invention Grant
- Patent Title: Edge ring and plasma processing apparatus
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Application No.: US17017487Application Date: 2020-09-10
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Publication No.: US11862437B2Publication Date: 2024-01-02
- Inventor: Yasuhisa Ishima
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 20047330 2020.03.18
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/687

Abstract:
According to one embodiment, an edge ring is provided which includes a first movable portion provided along an outer circumference of a support portion having an upper surface capable of holding a semiconductor substrate thereon, the first movable portion being movable in a direction perpendicular to the upper surface; a second movable portion provided along an outer circumference of the first movable portion, the second movable portion being movable in the direction; and a driving portion capable of moving the first movable portion in the direction by way of the second movable portion.
Public/Granted literature
- US20210296096A1 EDGE RING AND PLASMA PROCESSING APPARATUS Public/Granted day:2021-09-23
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