Invention Grant
- Patent Title: Device and method for bonding of two substrates
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Application No.: US18083806Application Date: 2022-12-19
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Publication No.: US11862487B2Publication Date: 2024-01-02
- Inventor: Markus Wimplinger , Florian Kurz , Viorel Dragoi
- Applicant: EV Group E. Thallner GmbH
- Applicant Address: AT St. Florian am Inn
- Assignee: EV Group E. Thallner GmbH
- Current Assignee: EV Group E. Thallner GmbH
- Current Assignee Address: AT St. Florian am Inn
- Agency: KUSNER & JAFFE
- Main IPC: H01L21/18
- IPC: H01L21/18 ; H01L21/67 ; H01L21/20 ; H01L21/687
Abstract:
A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.
Public/Granted literature
- US20230117625A1 DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES Public/Granted day:2023-04-20
Information query
IPC分类:
