Invention Grant
- Patent Title: Monitor wafer measuring method and measuring apparatus
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Application No.: US17598807Application Date: 2021-06-16
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Publication No.: US11862495B2Publication Date: 2024-01-02
- Inventor: He Zhu
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Cooper Legal Group, LLC
- Priority: CN 2110108391.9 2021.01.27
- International Application: PCT/CN2021/100249 2021.06.16
- International Announcement: WO2022/160564A 2022.08.04
- Date entered country: 2021-09-27
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01L21/67 ; G01B11/27

Abstract:
The present invention relates to a monitor wafer measuring method and measuring apparatus. The monitor wafer measuring method comprises the following steps: fixing a product wafer, the product wafer having several alignment marks and product measuring sites corresponding respectively to the alignment marks; determining the product measuring sites according to the alignment marks; and placing a monitor wafer, a projection of the monitor wafer in a vertical direction being aligned with and coinciding with the product wafer. The present application can reduce or even eliminate positional errors of the monitor wafer during a measurement process, such that product-level measuring position accuracy can be achieved for the monitor wafer and further, the measuring machine itself and process changes can be monitored in a better way.
Public/Granted literature
- US20220406636A1 MONITOR WAFER MEASURING METHOD AND MEASURING APPARATUS Public/Granted day:2022-12-22
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