Invention Grant
- Patent Title: Mask-integrated surface protective tape, and method of producing a semiconductor chip using the same
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Application No.: US16549910Application Date: 2019-08-23
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Publication No.: US11862504B2Publication Date: 2024-01-02
- Inventor: Akira Akutsu , Tomoaki Uchiyama
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: CHEN YOSHIMURA LLP
- Priority: JP 17034164 2017.02.24
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/3065 ; H01L21/308 ; H01L21/82
Abstract:
A mask-integrated surface protective tape, which has at least a substrate film and a mask material layer, wherein the mask material layer is provided directly on the substrate film, or is provided on the substrate film through a temporary-adhesive layer, and wherein a parallel ray transmittance of the mask material layer at a wavelength region of 355 nm is 30% or less; and a method of producing a semiconductor chip.
Information query
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