- Patent Title: Semiconductor device package and a method of manufacturing the same
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Application No.: US17695757Application Date: 2022-03-15
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Publication No.: US11862525B2Publication Date: 2024-01-02
- Inventor: Tsung-Yu Lin , Pei-Yu Wang , Chung-Wei Hsu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/00 ; H01L23/053 ; H01L21/50 ; H01L33/48 ; H01L23/04 ; G01L19/14
Abstract:
A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.
Public/Granted literature
- US20220208623A1 SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-06-30
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