Invention Grant
- Patent Title: Patch accommodating embedded dies having different thicknesses
-
Application No.: US16649923Application Date: 2017-12-29
-
Publication No.: US11862619B2Publication Date: 2024-01-02
- Inventor: Srinivas Pietambaram , Robert Alan May , Kristof Darmawikarta , Hiroki Tanaka , Rahul N. Manepalli , Sri Ranga Sai Boyapati
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2017/069060 2017.12.29
- International Announcement: WO2019/132992A 2019.07.04
- Date entered country: 2020-03-23
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/538 ; H01L25/065 ; H01L25/00 ; H01L21/48 ; H01L23/00
Abstract:
Techniques for a patch to couple one or more surface dies to an interposer or motherboard are provided. In an example, the patch can include multiple embedded dies. In an example, a microelectronic device can be formed to include a patch on an interposer, where the patch can include multiple embedded dies and each die can have a different thickness.
Public/Granted literature
- US20200266184A1 PATCH ACCOMODATING EMBEDDED DIES HAVING DIFFERENT THICKNESSES Public/Granted day:2020-08-20
Information query
IPC分类:
