Invention Grant
- Patent Title: Recycle wafer of silicon carbide and method for manufacturing silicon carbide semiconductor device
-
Application No.: US17420416Application Date: 2019-09-26
-
Publication No.: US11862684B2Publication Date: 2024-01-02
- Inventor: Tsubasa Honke , Kyoko Okita
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JP 19001173 2019.01.08
- International Application: PCT/JP2019/037837 2019.09.26
- International Announcement: WO2020/144900A 2020.07.16
- Date entered country: 2021-07-02
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L21/02

Abstract:
A recycle wafer of silicon carbide has a silicon carbide substrate and a first silicon carbide layer. The silicon carbide substrate has a first main surface and a second main surface opposite to the first main surface. The first silicon carbide layer is in contact with the first main surface. The silicon carbide substrate includes a substrate region that is within 10 μm from the first main surface toward the second main surface. In a direction perpendicular to the first main surface, a value obtained by subtracting a value that is three times a standard deviation of a nitrogen concentration in the substrate region from an average value of the nitrogen concentration in the substrate region is greater than a minimum value of a nitrogen concentration in the first silicon carbide layer.
Public/Granted literature
- US20220085172A1 RECYCLE WAFER OF SILICON CARBIDE AND METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2022-03-17
Information query
IPC分类: