Multi-dimensional photonic integrated circuits are provided, including a substrate having a first side and a second side, a multi-dimensional package having multi-dimensional planes, and one or more optical components connected to the first side and the second side of the substrate and on the multi-dimensional planes of the multi-dimensional package. The multi-dimensional planes include one or more horizontal sides and one or more vertical sides. One or more of the optical components are mounted on at least one of the horizontal sides of the multi-dimensional package and one or more of the optical components are mounted on at least one of the vertical sides of the multi-dimensional package. Hybrid systems of conventional multi-dimensional integrated circuits and multi-dimensional photonic integrated circuits also are provided.