Invention Grant
- Patent Title: Light-emitting diode and method for manufacturing the same
-
Application No.: US17212450Application Date: 2021-03-25
-
Publication No.: US11862753B2Publication Date: 2024-01-02
- Inventor: Yung-Ling Lan , Chenghung Lee , Chan-Chan Ling , Chia-Hao Chang
- Applicant: Anhui San'an Optoelectronics Co., Ltd.
- Applicant Address: CN Wuhu
- Assignee: ANHUI SAN'AN OPTOELECTRONICS CO., LTD.
- Current Assignee: ANHUI SAN'AN OPTOELECTRONICS CO., LTD.
- Current Assignee Address: CN Anhui
- Agency: Thomas | Horstemeyer, LLP
- Priority: CN 2010228719.6 2020.03.27
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/14 ; H01L33/12 ; H01L33/32 ; H01L33/38

Abstract:
A light-emitting diode includes a first type semiconductor layer, a stress relief layer disposed on the first type semiconductor layer and including at least one first repeating unit containing a first well layer and a first barrier layer that are alternately stacked, an active layer disposed on the stress relief layer and including at least one second repeating unit containing a second well layer and a second barrier layer that are alternately stacked, a second type semiconductor layer disposed on the active layer, a first electrode electrically connected to the first type semiconductor layer, and a second electrode electrically connected to the second type semiconductor layer. The first well layer is made of an In-containing material. The second well layer is made of an In-containing material. The second barrier layer is formed with multiple sub-layers, each of which is made of an Al-containing material.
Public/Granted literature
- US20210305453A1 LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-09-30
Information query
IPC分类: