Invention Grant
- Patent Title: Electronic package
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Application No.: US17485010Application Date: 2021-09-24
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Publication No.: US11862757B2Publication Date: 2024-01-02
- Inventor: Olivier Zanellato , Remi Brechignac , Jerome Lopez
- Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
- Applicant Address: FR Grenoble
- Assignee: STMICROELECTRONICS (GRENOBLE 2) SAS
- Current Assignee: STMICROELECTRONICS (GRENOBLE 2) SAS
- Current Assignee Address: FR Grenoble
- Agency: SEED IP LAW GROUP LLP
- Priority: FR 09984 2020.09.30
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L31/0203 ; H01L31/18 ; H01L33/00
Abstract:
The present description concerns a package for an electronic device. The package including a plate and a lateral wall, separated by a layer made of a bonding material and at least one region made of a material configured to form in the region an opening between the inside and the outside of the package when the package is heated.
Public/Granted literature
- US20220102591A1 ELECTRONIC PACKAGE Public/Granted day:2022-03-31
Information query
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