Invention Grant
- Patent Title: Optical module having restriction body fixed to stem and having a linear thermal expansion coefficient smaller than that of the stem
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Application No.: US16771153Application Date: 2018-02-09
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Publication No.: US11862930B2Publication Date: 2024-01-02
- Inventor: Akio Shirasaki , Tatsuki Otani , Norio Okada
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2018/004583 2018.02.09
- International Announcement: WO2019/155602A 2019.08.15
- Date entered country: 2020-06-09
- Main IPC: H01S5/02326
- IPC: H01S5/02326 ; H01S5/02253 ; H01S5/02212 ; H01S5/0231 ; H01S5/0239 ; H01S5/024 ; H01S5/02251

Abstract:
An optical module includes: a stem including a first surface and a second surface opposite to the first surface; a thermoelectric cooler including a heat-releasing substrate fixed to the first surface; a semiconductor laser element attached to the thermoelectric cooler; a cap fixed to the first surface and covering the thermoelectric cooler and the semiconductor laser element; a lens fixed to the cap; and a restriction body fixed to the second surface. The linear thermal expansion coefficients of the heat-releasing substrate and the restriction body are smaller than the linear thermal expansion coefficient of the stem.
Public/Granted literature
- US20210184424A1 OPTICAL MODULE Public/Granted day:2021-06-17
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