Invention Grant
- Patent Title: High-frequency front end module and communication device
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Application No.: US18170021Application Date: 2023-02-16
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Publication No.: US11863215B2Publication Date: 2024-01-02
- Inventor: Motoji Tsuda , Takayuki Nakamura , Daerok Oh
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP 18018138 2018.02.05
- Main IPC: H04B7/0413
- IPC: H04B7/0413 ; H04B1/00 ; H04B1/12 ; H04B1/18

Abstract:
A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.
Public/Granted literature
- US20230208452A1 HIGH-FREQUENCY FRONT END MODULE AND COMMUNICATION DEVICE Public/Granted day:2023-06-29
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