Invention Grant
- Patent Title: Chassis as a common cooling solution for die packages
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Application No.: US17485966Application Date: 2021-09-27
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Publication No.: US11864344B2Publication Date: 2024-01-02
- Inventor: Christopher M. Jaggers
- Applicant: ADVANCED MICRO DEVICES, INC.
- Applicant Address: US CA Santa Clara
- Assignee: ADVANCED MICRO DEVICES, INC.
- Current Assignee: ADVANCED MICRO DEVICES, INC.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/18 ; G06F1/20
Abstract:
A computing device chassis for a common cooling solution for die packages comprising: a chassis base comprising: an internal cavity; a cooling element housed in the internal cavity; and one or more thermal interfaces to the cooling element.
Public/Granted literature
- US20230098181A1 CHASSIS AS A COMMON COOLING SOLUTION FOR DIE PACKAGES Public/Granted day:2023-03-30
Information query
