Invention Grant
- Patent Title: Wearable electronic device including heat dissipation structure
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Application No.: US17674302Application Date: 2022-02-17
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Publication No.: US11864364B2Publication Date: 2024-01-02
- Inventor: Sangchul Jung , Hansang Kim , Yonghyun Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR 20210015311 2021.02.03
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G02B27/01 ; G06F1/16 ; G06F1/20

Abstract:
A wearable electronic device is provided. The wearable electronic device includes a housing including a first portion constituting a first outer surface of the wearable electronic device and a second portion constituting a second outer surface of the wearable electronic device, at least one electronic component positioned in an inner space of the housing and configured to emit heat, and multiple support structures which are at least partially positioned to correspond to the at least one electronic component between the first portion and the second portion, wherein a boundary part between the first portion and the second portion is at least partially positioned along a surface boundary between the first outer surface and the second outer surface and includes at least one opening, and an at least one distancing space between the multiple support structures is configured to communicate with an outer space of the housing through the at least one opening.
Public/Granted literature
- US20220248572A1 WEARABLE ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE Public/Granted day:2022-08-04
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