Invention Grant
- Patent Title: Laser machining apparatus and laser machining method
-
Application No.: US16089878Application Date: 2017-03-30
-
Publication No.: US11865637B2Publication Date: 2024-01-09
- Inventor: Sotohiro Muratani , Masahiro Tsukamoto , Yoshinori Funada , Yorihiro Yamashita
- Applicant: MURATANI MACHINE INC. , ISHIKAWA PREFECTURE , OSAKA UNIVERSITY
- Applicant Address: JP Kanazawa
- Assignee: MURATANI MACHINE INC.,ISHIKAWA PREFECTURE,OSAKA UNIVERSITY
- Current Assignee: MURATANI MACHINE INC.,ISHIKAWA PREFECTURE,OSAKA UNIVERSITY
- Current Assignee Address: JP Kanazawa; JP Kanazawa; JP Suita
- Agent Manabu Kanesaka
- Priority: JP 16071462 2016.03.31
- International Application: PCT/JP2017/013305 2017.03.30
- International Announcement: WO2017/170890A 2017.10.05
- Date entered country: 2018-09-28
- Main IPC: B23K26/064
- IPC: B23K26/064 ; B23K26/21 ; B23K26/14 ; B23K26/34 ; B23K26/146 ; B23K26/342

Abstract:
A laser machining device includes a plurality of optical fibers and a collimator lens arranged in parallel along a supply nozzle for supplying a molten material, and a laser beam projected from the optical fiber is applied onto an axis between a tip of the supply nozzle and a build-up welding spot.
Public/Granted literature
- US20190111517A1 LASER MACHINING APPARATUS AND LASER MACHINING METHOD Public/Granted day:2019-04-18
Information query
IPC分类: