Invention Grant
- Patent Title: Data processing apparatus, sensor and methods
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Application No.: US17430402Application Date: 2020-02-14
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Publication No.: US11867534B2Publication Date: 2024-01-09
- Inventor: Rajni Agarwal
- Applicant: Sony Group Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Group Corporation
- Current Assignee: Sony Group Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: GB 04422 2019.03.29
- International Application: PCT/GB2020/050356 2020.02.14
- International Announcement: WO2020/201680A 2020.10.08
- Date entered country: 2021-08-12
- Main IPC: G01D21/00
- IPC: G01D21/00 ; H04W84/02 ; G01C21/34 ; G01C21/36

Abstract:
A data processing method comprising: receiving, from each of a plurality of sensors each located at a respective location, a signal indicative of a respective value of a parameter measured by that sensor at a respective one of a plurality of successive times; and determining, based on the value of the parameter measured by one or more first sensors of the plurality of sensors at a respective one or more of the plurality of successive times, a value of the parameter at the location of a second sensor of the plurality of sensors at one of the one or more of the plurality of successive times.
Public/Granted literature
- US20220107192A1 DATA PROCESSING APPARATUS, SENSOR AND METHODS Public/Granted day:2022-04-07
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