Invention Grant
- Patent Title: Dynamic processing element array expansion
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Application No.: US18154576Application Date: 2023-01-13
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Publication No.: US11868895B2Publication Date: 2024-01-09
- Inventor: Randy Renfu Huang , Ron Diamant , Richard John Heaton
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: G06E1/00
- IPC: G06E1/00 ; G06E3/00 ; G06T7/00 ; G06N3/08 ; G06N3/04

Abstract:
A computer-implemented method includes receiving a neural network model that includes a tensor operation, dividing the tensor operation into a set of sub-operations, and generating instructions for performing a plurality of sub-operations of the set of sub-operations on respective computing engines of a plurality of computing engines on a same integrated circuit device or on different integrated circuit devices. Each sub-operation of the set of sub-operations generates a portion of a final output of the tensor operation. An inference is made based on a result of a sub-operation of the plurality of sub-operations, or based on results of the plurality of sub-operations.
Public/Granted literature
- US20230153620A1 DYNAMIC PROCESSING ELEMENT ARRAY EXPANSION Public/Granted day:2023-05-18
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