Invention Grant
- Patent Title: Coil component
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Application No.: US16773071Application Date: 2020-01-27
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Publication No.: US11869698B2Publication Date: 2024-01-09
- Inventor: Ju Hwan Yang , Seung Min Lee , Byung Soo Kang , Byeong Cheol Moon , Yong Hui Li
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20190101779 2019.08.20
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/255 ; H01F17/04 ; H01F27/32 ; H01F41/04

Abstract:
A coil component includes a body having one surface and the other surface, opposing each other, and one side surface and the other side surface, each connecting the one surface and the other surface to each other, opposing each other, a recess formed in each of the one side surface and the other side surface of the body to extend to the one surface of the body, a support substrate disposed inside the body, a coil portion, disposed on the support substrate, having one end portion and the other end portion exposed to the recess, an oxide insulating layer disposed on a surface of the body, and a first insulating layer disposed along a surface of the oxide insulating layer to cover the surface of the body.
Public/Granted literature
- US20210057138A1 COIL COMPONENT Public/Granted day:2021-02-25
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